JPH02852B2 - - Google Patents
Info
- Publication number
- JPH02852B2 JPH02852B2 JP9295484A JP9295484A JPH02852B2 JP H02852 B2 JPH02852 B2 JP H02852B2 JP 9295484 A JP9295484 A JP 9295484A JP 9295484 A JP9295484 A JP 9295484A JP H02852 B2 JPH02852 B2 JP H02852B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- molybdenum
- copper
- rolling
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052750 molybdenum Inorganic materials 0.000 claims description 48
- 239000011733 molybdenum Substances 0.000 claims description 48
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 239000010949 copper Substances 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 43
- 239000002131 composite material Substances 0.000 claims description 39
- 239000007772 electrode material Substances 0.000 claims description 25
- 238000005096 rolling process Methods 0.000 claims description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 10
- 238000005098 hot rolling Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002751 molybdenum Chemical class 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9295484A JPS60239032A (ja) | 1984-05-11 | 1984-05-11 | 銅・モリブデン複合電極材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9295484A JPS60239032A (ja) | 1984-05-11 | 1984-05-11 | 銅・モリブデン複合電極材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60239032A JPS60239032A (ja) | 1985-11-27 |
| JPH02852B2 true JPH02852B2 (en]) | 1990-01-09 |
Family
ID=14068848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9295484A Granted JPS60239032A (ja) | 1984-05-11 | 1984-05-11 | 銅・モリブデン複合電極材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60239032A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0436349U (en]) * | 1990-07-23 | 1992-03-26 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4988392A (en) * | 1989-05-30 | 1991-01-29 | Nicholson Richard D | Composite sheet made of molybdenum and dispersion-strengthened copper |
| CN100404197C (zh) * | 2006-04-10 | 2008-07-23 | 安泰科技股份有限公司 | 铜/钼/铜电子封装复合材料的制备方法 |
-
1984
- 1984-05-11 JP JP9295484A patent/JPS60239032A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0436349U (en]) * | 1990-07-23 | 1992-03-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60239032A (ja) | 1985-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2473712A (en) | Procedure for making multiply metal stock | |
| US7776454B2 (en) | Ti brazing strips or foils | |
| US3261724A (en) | Stainless steel clad aluminum and methods of making same | |
| US4029479A (en) | Plated foil for liquid interface bonding of titanium | |
| JP3047752B2 (ja) | チタンクラッド鋼板の製造方法 | |
| JPH02852B2 (en]) | ||
| JPH11284111A (ja) | ヒートシンク部材及びその製造方法、並びにヒートシンク部材を用いた半導体パッケージ | |
| US3821848A (en) | Copper backed electrical contact and method of making the same | |
| JP3110170B2 (ja) | 板状体のろう接方法 | |
| JPH05185245A (ja) | 低電気抵抗性金属部材の抵抗溶接方法 | |
| JP2503778B2 (ja) | 半導体装置用基板 | |
| JP2003001302A (ja) | アルミナ分散強化銅の製造方法 | |
| EP3023189B1 (en) | Brazing sheet for surface joining | |
| JPS59185588A (ja) | クラツド板の製造方法 | |
| JPS6036652A (ja) | 電気接点の製造方法 | |
| CN115070254B (zh) | 一种硬质合金钎焊用复合钎料及其制备方法 | |
| JPS63317267A (ja) | チタンクラッド鋼の製造方法 | |
| JP3090030B2 (ja) | 液相拡散接合方法 | |
| JPH0593253A (ja) | アーク溶射用ワイヤ | |
| CN207239483U (zh) | 一种cab无钎剂钎焊的焊片 | |
| JPH0512077B2 (en]) | ||
| JPS6317555B2 (en]) | ||
| JPH02205277A (ja) | 銅または銅合金を中間媒接材としたチタンクラッド薄鋼板の製造方法 | |
| KR850000796B1 (ko) | 클래드강판(clad 鋼板)의 제조방법 | |
| JPH05169283A (ja) | クラッド鋼板の製造方法 |